基于MSP430单片机的温度监控系统设计

摘要

当前，温度控制系统被广泛应用于生活的很多方面，它与人们的日常生活、工作和学习息息相关。如何设计制作一个性能良好的温度监控系统，实现温度的精确、实时监控成为设计该系统的主要问题。随着我国电子技术的不断提高，以单片机为核心处理器，温度传感器为远端设备构成的温度监控系统逐渐成为时下的主流设计。

论文介绍了温度控制系统的研究背景和研究意义，国内外发展状况，超低功耗系列单片机MSP430，单总线数字温度传感器DS18B20等器件以及设计所需的相关软件的使用。在此基础上，对系统进行设计、编程和调试，并绘制了系统的电路原理图和印制板图。该温度监控系统具有监控多点温度，并将其循环显示，利用按键实现某一点的选择显示，从而实现多点温度的实时监控的功能。

关键词：超低功耗单片机，单总线温度传感器，JTAG仿真

ABSTRACT

Currently, The temperature control system is widely used in our daily life and closely linked with our work and study. How to design and make a temper -ature control system which has the characters of high performance, accurate measurement,real time monitoring is still a main problem. As with the high de -velopment of the electronic technique in our country, the temperature control system used the microcontroller as the centre and thermal sensor as the far-end equipment is becoming the main trend.

In this paper, it introduces the research background and the significance of the temperature control system, the situation at home and abroad. the MSP430 series MCU which is widely used now ,the digital thermal sensor, DS18B20 and so on. At that basis , we design, programe and debug it, draw the SCH and PCB about it in the Protel. It can monitor the temperature of multi-points and choose one to display in the LCD by pressing the key, which leads to realizing the meal time monitoring of the temperature of these points.

Keywords:Ultralow-Power microcontroller, the one-wire digital thermal sensor, JTAG simulation

目录

1 绪论 ................................................................................................................................ 1

1.1研究背景和意义 ................................................................................................ 1 1.2 国内外动向 ........................................................................................................ 2 1.3 课题的主要研究内容 ...................................................................................... 4

2 系统方案设计 .......................................................................................................... 6

2.1 MSP430系列单片机 ......................................................................................... 6 2.2 DS18B20数字温度传感器 .............................................................................11 2.3 DS1302日历时钟芯片 ................................................................................... 17 2.4 OCMJ4x8B液晶显示模块 .............................................................................. 20 2.5 键盘.................................................................................................................... 24 2.6 JTAG仿真和IAR Workbench ...................................................................... 26 2.7 结语.................................................................................................................... 30

3 系统电路及软件实现 ........................................................................................ 31

3.1系统设计框图及功能实现 ............................................................................ 31 3.2单元电路原理图 .............................................................................................. 32 3.3 系统程序设计 ................................................................................................. 37 3.4结语 ..................................................................................................................... 45

4 总结与展望 .............................................................................................................. 46 参考文献 ........................................................................................................................ 48 致 谢 ................................................................................................................................ 50

附录 ................................................................................................................................... 51

附录1 外文文献 ..................................................................................................... 51 附录2 温度监控系统C语言程序 ..................................................................... 64 附录3 电路原理图和印制板图 ......................................................................... 72