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CABLE加工中英文翻译
at 60 degrees
烙铁头要保持清洁. Keep the brand iron clean.
送锡要均匀,锡勿用得过多,过少,标准见<焊点检验规范> Giving tin should be even. The tin can't be too much or too little. The standard refers to
注意勿被烙铁头烫伤. Attention not to scald the brand iron.
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注意安全. Pay attention to the safety.
自动送锡焊锡PCB作业规范 auto soldering PCB operation criterion 焊锡机插上电源,调整焊锡温度,使烙铁头预热约5分钟
Power on the soldering machine, turn the temperature adjustment knob to the range between 260 and 280℃, then pre-heated the brand iron for 5 minutes. IPQC对烙铁头的温度进行检查,使之保证焊锡的温度260-280 IPQC tests the temperature of the brand iron, make sure the temperature is between 260 and 320℃ 作业员用湿润的海棉将烙铁头擦干净 Operator wipes up the brand iron with a wet sponge 焊接之线材和连接器(PCB)型号是否正确.
Check whether the type the cable and connector is correct or not. 剥线长度是否符合要求,是否平齐,无散乱现象,
Eye-watch whether the length of the cords meets the requirement or not;
Whether the cords are even or not; whether the cords are loose and disorderly or not. 不符合要求的需作修剪.Clip the disaccorded ones 照配线表,芯线与连接器(PCB)的配线要求.
According to the wiring requirement of the cords and the connector (PCB). 将待焊的PCB板放于固定治具上定位. Fasten the PCB on the test fixture. 左手拿芯线(PCB),右手拿CONNECTOR.
Hold cords in the left hand and the connector in the right hand
将待焊对象放至烙铁咀下(芯线不得碰到锡线,且要注意芯线与CONNECTOR的相对位置: 0.5MM,)进行焊接,脚起动开关进行点焊. 焊接时间与机器送锡时间要同步进行,如下图.
Place the object under mouth of the brand iron (the cords can not touch the tin filament, and notice the relative distance of the cords and the connector, which is 0.5mm) to solder, starting-up the switch with foot. The time of soldering and the time of machine’s giving tin should be synchronous.
点焊的时间对点焊的品质有很大的影响。
Soldering time impacts much on the quality of soldering.
对于点焊PCB与芯线时作业时间2-2.5秒.使用OD0.8锡丝,30W烙铁头
The operation time of soldering PCB and cords is 2-2.5s, and the OD of tin filament is 0.8mm, with 30W brand iron 对于点焊PCB与D-SUB时作业时间2-3秒。.使用OD0.8锡丝,30W烙铁头
The operation time of soldering PCB and D-SUB is 2-3s. Use tin filament with OD of 0.8 and brand iron with the power of
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CABLE加工中英文翻译
30W.
锡点冷却前不要动摇芯线与CONN连接器(PCB)间的锡点
Do not swing the tin point between the cords and connector before the tin point is cold down.
焊好需自我检查有无假焊,虚焊,焊接是否牢固,锡点是否光亮圆滑饱满,锡点过大.
Examine whether there are artificial soldering or weak soldering or not; whether the soldering is firm or not; whether the tin point is bright, round, smooth and full; whether the tin point is too bit or not. 操作注意事项:
点焊之前必须先确认材料,材料错误将置使产品重工或报废.
Make sure whether the materials are right or not before soldering. The wrong materials will result the rework and discard of the products.
被焊金属材料与PCB表面要清洁干净
The surface of the metal materials and PCB to be soldered should be clean.
温度调整要确当(PCB焊接温度260-280度,CONNECTOR焊接温度260-320度)温度太低将会置使虚焊或焊点不光亮;影响到抗拉强度.引起虚焊,温度太高会烫伤芯线与CONNECTOR胶心
The temperature’s adjustment should be proper (the soldering temperature of PCB is between 260 and 280 degrees while that of the connector if between 260 and 320 degrees). If the temperature is too low, it will result in weak soldering or not bright tin point and influence the pull-resistant strength. If the temperature is too high, it will scald the plastic center of the cords and the connector.
焊接与机器送锡要同步进行,焊接时间严格按照标准进行,不可在锡丝没有完全融化在焊接面就离开烙铁头,容易引起虚焊。
The soldering and machine’s tin’s giving should be synchronous. The time of soldering must be in accordance with the standard strictly. Do not move from the brand iron head before the tin filament has not been melt on the soldering surface. Otherwise, it will result in weak soldering easily.
焊接时间不可过少或过长,否则易引起虚焊或烫伤物料
The time of soldering should not be too long or too short. Otherwise, it will result in weak soldering or scald the materials. 锡丝冷却前不要动摇芯线与CONN连接器(PCB)间的锡点
Do not swing the tin point between the cords and the connector before the tin filament cools down.
点焊时必须严格参照配线表作业,以确保PIN位的正确性.因PIN位焊错或焊反,此产品用到机器设备上,将会导致机器烧毁等严重后果.
Operate in accordance with the wiring list strictly when soldering to make sure the right PIN’s position. If the PIN’s positions are soldered wrong or reverse, it will cause the destruction of the machines and other results when the products are used on the machines.
点焊时每次手里的线材与PCB不得多于1PCS,点焊好后桌面上的线材堆积不得多于2 把.
Each time the cable and PCB held in hand should not be more than one. Do not pile more than two bundles of cables on the surface of the work desk when they have been soldered.
点焊最好一次成功,否则易烫伤芯线,并易出现锡渣。
It is better to do successful soldering in one time. Otherwise, the cords will be scalded easily and tin dregs will appear. 焊点标准: Tin point standard
标准的焊点为光亮圆滑大小适中的半球形.
The standard soldering point should be bright, round and smooth half ball with proper size.
焊点不可有假焊,虚焊,搭焊,锡尖,锡渣,焊点过大过小,芯线分叉,焊接是否牢固,锡点不光亮.否则不可接收.
There should be no artificial soldering, weak soldering, joining soldering, spinous tin, tin dregs, too big or too small soldering points, branch-off cords, not firm soldering and not bright tin point. Otherwise, they will be rejected. 不可烫伤芯线,外皮及连接器的胶芯部分.
Do not scald the cords, outer shuck and the plastic center part of the connector. Page 18 of 41
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CABLE加工中英文翻译
PIN位不可焊错或焊反. PIN’s position should not be soldered wrong or reverse. 芯线上不得有锡渣. There should be no tin dregs on the cords.
铜丝叉出不可超出0.5mm The length of the exposed brass wires should not be more than 0.5mm. 锡点尖锐不可超过0.2mm Tin point’s spinous part should not be more than 0.2mm. 芯线收缩允许范围不可超过0.8mm或小于芯线OD
The accepted shrink range of the cords should not be more than 0.8mm or less than the OD of the cords. 标准的PCB焊点为光亮扁平修长大小适中的矩形.
The standard PCB soldering point is bright, flat and lathy rectangle with proper size.
焊点不可有假焊,虚焊,搭焊,锡尖,锡渣,焊点过大过小,芯线分叉,焊接是否牢固,锡点光亮.否则不可接收.
There should be no artificial soldering, weak soldering, joining soldering, spinous tin, tin dregs, too big or too small soldering points, branch-off cords, not firm soldering and not bright tin point. Otherwise, they will be rejected. 焊锡范围不可超出PCB 金属PIN针范围
The soldering range should not be beyond the range of the PINs of the PCB metal. 不可烫伤芯线,外皮及PCB其它组件的部分.
Do not scald the cords, outer shuck and other parts of PCB.
PIN位不可焊错或焊反. PIN’s position should not be soldered wrong or reverse. PCB上不得有锡渣. There should be no tin dregs on the cords.
铜丝叉出不可超出0.5mm. The length of the exposed brass wires should not be more than 0.5 mm. 锡点尖锐不可超过0.2m. Tin point’s spinous part should not be more than 0.2 mm.
辅助工具及配件简介brief instruction of assistant tools and supplement : 海棉的使用the usage of sponge:
海棉为清洁烙铁头的清洁剂,可将烙铁头表面的渣滓去净,使烙铁头的温度充分传递到需焊接的金属上 Sponge is a cleanser used for cleaning up the tin dregs on the surface of the brand iron, so that the temperature of the brand iron can transfer to the objects completely.
海棉是可挤压物体,水湿则涨大.使用海棉时,先湿水再挤干.否则会损坏烙铁头.
Sponge is a kind of flexible substance, which will swell when it is wet. So when using sponge, welter it first and then make it dry. Otherwise, it will mangle the brand iron.
海棉擦拭的时间勿过长,否则海棉的水分使烙铁头的温度下降,在做业时就不能顺利完成,一定要快速擦拭,一般时间为1秒左右
When wipe the brand iron with the sponge, the time should not be too long. In that case, the moisture will make the
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temperature decline; even influence the completion of the operation. The standard time for wiping is about 1 second. 烙铁头的维护和使用the maintenance and usage of brand iron: 烙铁头温度the temperature of brand iron:
温度过高会减弱烙铁功能,因此应选择尽可能低之温度, 此烙铁头的温度回复力优良,较低的温度也可充分的焊接可保护对温度敏感之组件
It will weaken the function of the brand iron if the temperature is too high, so adjust the temperature so low as possible. Because the brand iron has a good resilience, a lower temperature can protect the materials that are sensitive to temperature. .清理 cleaning
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CABLE加工中英文翻译
应定期使用清洁海棉清理焊接头,焊接后,烙铁头的残余焊剂所产生的氧化物和碳化物会损害烙铁头,造成焊接差误,或者使烙铁头导热功能减退, 长时间连续使用烙铁时,应每周一次拆开烙铁清洗氧化物,防止烙铁受损而减低温度。
Clean up the brand iron with a sponge periodically. The oxidation and carbonization left by the remnants soldering tin will cause soldering error or weaken the diathermancy function of brand iron. In order to keep the brand iron from mangling, take apart the brand iron to clean up the oxidation once a week after a long time of using. 当不使用时when stop using.
不使用烙铁时,不可让烙铁长时间处于高温状态,会使烙铁头上的焊剂转化为氧化物,致使烙铁头导热功能大为减退。应及时镀锡后关闭电源。
Don’t keep the brand iron on high temperature for a long time when stop using. In that case, it will cause the soldering tin transform into oxidation and weaken the diathermancy function of brand iron. So turn off the power after using. 使用后 after using.
使用后,应抹净烙铁头, 应镀上新锡层,及时关闭电源。以防止烙铁头引起氧化作用。
In order to keep the brand iron from being oxidizing, clean up the brand iron and solder some fresh tins after using. And turn off the power in time.
烙铁头的保养the maintenance of brand iron:
检查和清理烙铁头. Examine and clean up the brand iron
设定温度为摄氏250度(华氏482度). Temperature: 250℃(482 Fahrenheit)
温度稳定后,以清洁海棉清理烙铁头,并检查烙铁头状况
After the stabilization of temperature, clean up the brand iron with a sponge and examine the status of the brand iron. 如果烙铁头的镀锡部分含有黑色氧化物时,可镀上新锡层,再用清洁海棉抹净烙铁头.如此重复清理,直到彻底除去氧化物为止,然后再镀上新锡层
If the soldering part of the brand iron contains black oxidation, solder some fresh tins, and wipe up the brand iron. Repeat this process until removing the oxidation thoroughly, and then solder fresh tins. 如果烙铁头变形或生锈氧化,必须替换新的
If the brand iron becomes distorted or oxidation, it must be replaced by a new one. 切勿用锉刀剔除烙铁头上的氧化物 Forbid to eliminate the oxidation with a file.
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焊锡检验相关知识 the relevant knowledge on soldering:
焊接的不良缺陷及说明the NG phenomenon and instruction of soldering:
虚焊: 芯线与连接器间的锡溶合时间过短, 使芯线与连接器之间无一定的受力,用手轻轻一拉锡点就会脱落.
Artificial soldering: the time for tin melting between the cords and connector is too short. There is no certain pull between them, so the tin point will shed easily.
冷焊: 焊接时温度不够, 锡未完全溶合或者是锡点呈雾面, 造成芯线与连接器之间无一定的受力,用手轻轻一拉锡点就会脱落.
Cold soldering: The temperature is too low, the tin could not be molten completely or the tin point with misty appearance. There is no certain pull between the cords and connector, so the tin point will shed easily.
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