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摘 要
摘 要
随着节能环保意识的提高,节能灯产业得到了迅猛的发展。节能灯在追求节能环保的同时,也趋向功能细分化,功能多样化发展。本文设计的智能感应调光灯,就是以人到灯亮,人走灯灭为原则设计的功能化产品。
实现方法主要是利用红外处理芯片BISS0001对红外信号进行处理,并根据节能灯内部电子镇流器工作原理,应用此红外信号实现对灯的工作状态的控制。工作内容主要包括对红外信号接收和处理系统,低压供电和转化控制系统,电子镇流器系统的设计及构建。其中信号处理系统、低压供电和转化控制系统是整个系统的关键。
信号处理过程主要是利用BISS0001对传入的红外信号进行放大、比较等处理,最后把处理结果输出到转化控制系统。转换控制系统实现处理结果对镇流器工作状态的控制。低压供电系统贯穿整个信号采集、处理、输出控制过程。
关键词:红外信号处理,低压供电电路,智能感应开关,电子镇流器状态控制
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ABSTRACT
Abstract
Along with the exaltation of energy saving and environmental protection consciousness,energy-saving lamp industry has been rapid development. While pursuing better performance of energy saving and environmental protection, the direction of development is that energy-saving lamp tends to feature segmentation, functional diversification. In this paper, the design of smart sensors dimming light, that is, in order to achieve the target that if someone passes by ,the energy-saving lamp is lighting ;or the light is out.
The main achievable method is using infrared signals processing IC BISS0001 t, and in accordance with working principle of electronic ballast, using the infrared signal to control the state of energy-saving lamp. The main contents of work includes the infrared signal receiving and processing part, low-voltage power supply and control part, electronic ballast part. Among them ,the infrared signal processing part, low-voltage power supply and control part is the key to the whole system.
Infrared signal processing mainly amplify and compare with the incoming infrared signal by BISS0001 chip, and output the final results to control part. The control part achieves the results control the state of Electronic Ballast. Low-voltage power supply part is throughout the signal acquisition, processing and achieving the control.
Key words: infrared signal processing, low-voltage power supply circuits, smart sensors switch, control of electronic ballast state
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目 录
目 录
第一章 引言 ................................................................................................................. 1
第二章 系统框架 ............................................................................................................ 3 第三章 主要元件及电子镇流器原理 ............................................................................ 4
3.1 被动式热释电红外探头 .................................................................................... 4
3.1.1 热释电效应 .............................................................................................. 4 3.1.2 被动式热释电红外传感器的工作原理与特性 ...................................... 5 3.1.3 被动式热释电红外探头的优缺点 .......................................................... 6 3.1.4 热释电红外探头处理芯片原理及应用 .................................................. 6 3.2菲涅尔透镜 ......................................................................................................... 7 3.3光敏电阻 ............................................................................................................. 8
3.3.1 光敏电阻原理 .......................................................................................... 9 3.3.2 光敏电阻分类 .......................................................................................... 9 3.3.3 光敏电阻主要参数 ................................................................................ 10 3.3.4 光敏电阻制作材料 ................................................................................ 10 3.5 红外热释电处理芯片BISS0001................................................................. 10 3.6 电子镇流器 ...................................................................................................... 15
3.6.1半桥逆变电路工作原理 ......................................................................... 15 3.6.2 电容C5的续流作用 ............................................................................. 18
第四章 电路原理分析 .................................................................................................. 19
4.1供电系统 ........................................................................................................... 19
4.1.1阻容降压原理及电路 ............................................................................. 19 4.1.2 电阻分压原理及电路 ............................................................................ 21 4.2 信号采集及处理系统 ...................................................................................... 22 4.3 输出控制系统 .................................................................................................. 24
4.3.1应用可控硅控制方案分析 ..................................................................... 24 4.3.2应用继电器控制方案分析 ..................................................................... 27 4.3.3停振控制方案分析 ................................................................................. 28 4.4 电子镇流器应用电路分析 .............................................................................. 30 第五章 硬件电路的调试 .............................................................................................. 32
5.1 控制小片板设计与制作 .................................................................................. 32
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目 录
5.2 控制片板的性能测试 ...................................................................................... 34 结束语 ............................................................................................................................ 39 参考文献 ........................................................................................................................ 40 致 谢 .............................................................................................................................. 41 附 录 .............................................................................................................................. 42 外文资料原文 ................................................................................................................ 43 外文资料译文 ................................................................................................................ 47
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