AEC - Q006 - Rev -

AEC - Q006 - Rev- June 8, 2015 Automotive Electronics CouncilComponent Technical Committee AEC - Q006 - REV- QUALIFICATION REQUIREMENTS FOR COMPONENTS USING COPPER (Cu) WIRE INTERCONNECTIONS AEC - Q006 - Rev- June 8, 2015 Automotive Electronics CouncilComponent Technical Committee Acknowledgment Any document involving a complex technology brings together experience and skills from many sources. The Automotive Electronics Council would especially like to recognize the following significant contributors to the development of this document: Cu Wire Requirements Sub-Committee Members: Jeff Jarvis James Molyneaux Earl Fischer Bankim Patel Mark Sears Xin Miao Zhao Hadi Mehrooz John Timms Ramon Aziz Mark A. Kelly Bruce Hood Nick Lycoudes Stephen Lee Steve Sibrel Werner Kanert Scott Daniels Joe Lucia Tom Lawler Warren Chen Bob Knoell [Q006 Team Leader] Zhongning Liang Andreas Pinkernelle Rene Rongen Peter Turlo Kiran Kumar Vanam Francis Classe Bassel Atala Larry Ting James Williams Larry Dudley Arthur Chiang Krimo Sennaud AMRDEC Analog Devices Autoliv Autoliv Bose Corporation Cirrus Logic Continental Corporation Continental Corporation Delphi Corporation Delphi Corporation Freescale Freescale Freescale Harmon Infineon Technologies International Rectifier John Deere Lattice Semiconductor Macronix NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors ON Semiconductor Qualcomm Spansion STMicroelectronics Texas Instruments Texas Instruments TRW Automotive Vishay Xilinx AEC - Q006 - Rev- June 8, 2015 Automotive Electronics CouncilComponent Technical Committee NOTICE AEC documents contain material that has been prepared, reviewed, and approved through the AEC Technical Committee. AEC documents are designed to serve the automotive electronics industry through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than AEC members, whether the standard is to be used either domestically or internationally. AEC documents are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action AEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the AEC documents. The information included in AEC documents represents a sound approach to product specification and application, principally from the automotive electronics system manufacturer viewpoint. No claims to be in Conformance with this document shall be made unless all requirements stated in the document are met. Inquiries, comments, and suggestions relative to the content of this AEC document should be addressed to the AEC Technical Committee on the link http://www.aecouncil.com. Published by the Automotive Electronics Council. This document may be downloaded free of charge, however AEC retains the copyright on this material. By downloading this file, the individual agrees not to charge for or resell the resulting material. Printed in the U.S.A. All rights reserved Copyright ? 2015 by the Automotive Electronics Council. This document may be freely reprinted with this copyright notice. This document cannot be changed without approval from the AEC Component Technical Committee. AEC - Q006 - Rev- June 8, 2015 Automotive Electronics CouncilComponent Technical Committee QUALIFICATION REQUIREMENTS FOR COMPONENTS USING COPPER (Cu) WIRE INTERCONNECTIONS 1. SCOPE This document contains a set of tests and defines the minimum requirements for qualification of copper (Cu) wire interconnections for components to be used in any automotive electronics application. While the set of tests highlighted here are replicated in AEC-Q100/Q101, this document details any different test conditions and/or durations plus the activity around these tests that are unique requirements for ensuring Cu wire reliability. Use of this document does not relieve the supplier of their responsibility to meet their own company's internal qualification program. In this document, %user is responsible to confirm and validate all qualification data that substantiates conformance to this document. If a supplier has already qualified Cu wire and is in production with no Cu wire related issues, the supplier does not have to requalify those approved components again per this document. 1.1 1.2 Purpose The purpose of this specification is to determine that a component is capable of passing the specified stress tests and thus can be expected to give a certain level of quality/reliability in the application. Reference Documents Current revision of the referenced documents will be in effect at the date of agreement to the qualification plan. Subsequent qualification plans will automatically use updated revisions of these referenced documents. 1.2.1 Automotive AEC-Q100 Failure Mechanism Based Stress Test Qualification for Integrated Circuits AEC-Q101 Failure Mechanism Based Stress Test Qualification for Discrete Semiconductors in Automotive Applications 1.2.2 JEDEC JESD22 Reliability Test Methods JESD22-A104 Temperature Cycling (TC) JESD22-A110 Highly Accelerated Stress Test (HAST) JESD22-A101 Temperature Humidity Bias (THB) / High Humidity High Temperature Reverse Bias (H3TRB) JESD22-A105 Power Temperature Cycle (PTC) JESD22-A103 High Temperature Storage Life (HTSL) / High Temperature Gate Bias (HTGB) J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices 1.2.3 Military MIL-STD-750, Method 1037 Intermittent Operation Life (IOL) MIL-STD-750, Method 1038 (condition A) High Temperature Reverse Bias (HTRB) Page 1 of 10